Tianyou Chai
Northeastern University, China

Diane J. Cook
Washington State University, USA

William A. Gruver
Simon Fraser University, Canada

Jie Huang
Chinese University of Hong Kong, HK

Masao Ikeda
Osaka University, Japan

Zexiang Li
Hong Kong University of Science & Technology, HK

Fumitoshi Matsuno
University of Electro-Communications, Japan

Eric Rogers
University of Southampton, UK

Houjun Wang
University of Electronic Science and Technology of China, China

Xin Yao
University of Birmingham, UK